توانمندی ها - تولید برد مدار چاپی - تولید فیبر مدار چاپی - تولید pcb
PCB Capability
| for the prototype |
for the batch |
items |
| 2-38 |
2-20 |
Layer
(Maximum)
|
| PTFE, PPO, PPE |
FR-4, Ceramic Substrate board, Aluminum based board, High-Tg |
Board Material Type |
| 6layer-8layer |
4layer-6layer |
Compound Material Lamination |
| |
610mm*1100mm |
Maximum Dimention |
| ±0.10mm |
±0.13mm |
Dimension Tolerance |
| 0.2mm-0.8mm |
0.2mm-6mm |
Board thickness coverage |
| ±5% |
±8% |
Board thickness tolerance
(t≥0.8mm)
|
| ±8% |
±10% |
Board thickness toleranc
(t<0.8mm)
|
| 0.07mm-1mm |
0.076mm-6mm |
DK thickness |
| 0.075mm |
0.1mm |
Min line width |
| 0.075mm |
0.1mm |
Min line space |
| 8.75um-280um |
8.75um-175um |
Out layer copper thickness |
| 17.5um-175um |
17.5um-175um |
Inner layer copper thickness |
| 0.15mm-0.25mm |
0.25mm-6mm |
Drilling hole diameter
(Mechanic cal drill)
|
| 0.1mm-0.2mm |
0.2mm-6mm |
Finished hole diameter
(Mechanical drill)
|
| |
0.05mm |
Hole diameter tolerance
(Mechanical drill)
|
| 0.05mm |
0.075mm |
Hole position tolerance
(Mechanical drill)
|
| 0.075 |
0.1mm |
Laser drill hole size |
| 12:1 |
10:1 |
Board thickness and hole diameter ratio |
| |
Green, Yellow, Black, Purple, Blue, White, Red |
Solder mask type |
| 0.075mm |
0.1mm |
Minimum solder mask Dam |
| 0.025mm |
0.05mm |
Minimum size of solder mask separation ring |
| 0.6mm-0.8mm |
0.25mm-0.6mm |
solder mask oil plug hole diameter |
| ±5% |
±10% |
impedanece control tolerance |
| Immersion Tin, OSP |
Hot Air Level, ENIG, Immersion silver, Gold plating, Immersion tin, Gold Finger |
Surface finish |